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Volumn , Issue , 2007, Pages 684-689

A flexible and stretchable tactile sensor utilizing static electricity

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICITY; ELECTROSTATICS; INTELLIGENT ROBOTS; INTELLIGENT SYSTEMS; OPTICAL SENSORS; ROBOTICS; ROBOTS; SILICONES;

EID: 51349155095     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IROS.2007.4399523     Document Type: Conference Paper
Times cited : (28)

References (10)
  • 7
    • 0036284068 scopus 로고    scopus 로고
    • Development of soft and distributed tactile sensors and the application to a humanoid robot
    • R. Tajima, S. Kagami, M. Inaba, and H. Inoue. "Development of soft and distributed tactile sensors and the application to a humanoid robot," Advanced Robotics, vol. 16, no. 4, pp. 381-397, 2002.
    • (2002) Advanced Robotics , vol.16 , Issue.4 , pp. 381-397
    • Tajima, R.1    Kagami, S.2    Inaba, M.3    Inoue, H.4
  • 9
    • 33947539329 scopus 로고    scopus 로고
    • Haptic communication between humans and robots
    • Robotics Research, Thrun, Brooks, and Durrant-Whyte, Eds. Springer
    • T. Miyashita, T. Tajika, H. Ishiguro, K. Kogure, and N. Hagita, "Haptic communication between humans and robots," in Robotics Research, ser. Springer Tracts in Advanced Robotics, Thrun, Brooks, and Durrant-Whyte, Eds. Springer, 2007, vol. 28, pp. 525-536.
    • (2007) ser. Springer Tracts in Advanced Robotics , vol.28 , pp. 525-536
    • Miyashita, T.1    Tajika, T.2    Ishiguro, H.3    Kogure, K.4    Hagita, N.5
  • 10
    • 51349132266 scopus 로고    scopus 로고
    • M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, and H. Ishiguro, A super-flexible sensor system for humanoid robots and related applications, in In Proceedings of the International Conference on Electronics Packaging, 2007, pp. 114-119.
    • M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, and H. Ishiguro, "A super-flexible sensor system for humanoid robots and related applications," in In Proceedings of the International Conference on Electronics Packaging, 2007, pp. 114-119.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.