Reflowable ISM WLP

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 297-302

  Won, Kyu Jeung ^a   Chang, Hyun Lim ^a   Jingli, Yuan ^a   Seung, Wook Park ^a   Seog, Moon Choi ^a   Sung, Yi ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; CHIP SCALE PACKAGES; COMPUTER NETWORKS; DIGITAL IMAGE STORAGE; ELECTRONIC EQUIPMENT MANUFACTURE; GLASS BONDING; IMAGE SENSORS; POLYMERIC GLASS; SENSORS; THREE DIMENSIONAL; WAFER BONDING;

ELECTRONIC COMPONENTS; VIA HOLES; WARPAGE CONTROL;

PROCESS CONTROL;

EID: 51349139652     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549985     Document Type: Conference Paper

References (3)

1. Sengupta, K.; Sundahl, R.; Kawashima, S.; Arellano, R.; Sklenicka, C.; Thompson, D.; Electronics Manufacturing Technology Symposium 19-21 Oct. pp. 194-198(1998)
2. Viswanadam, G.; Bieck, F.; Suthiwongsunthor, N.; Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th Volume 1 pp. 153-157(2005)
3. Darveaux, R.; Chowdhury, A.; Tome, J.; Schoonejongen, R.; Reifel, M.; De Guzman, A.; Sung Soon Park; Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on 1-4 June 2004 Vol. 1 pp. 18-27(2004)