3D packaging architecture using paper as a dielectric medium

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 371-373

  Rida, Amin ^a   Yang, Li ^a   Chaisilwattana, Napol ^a   Travis, Scott ^a   Bhattacharya, Swapan ^a   Tentzeris, Manos M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; METALLIC OBJECTS; RADIO-FREQUENCY IDENTIFICATION; REAL TIME;

COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; RADIO FREQUENCY IDENTIFICATION (RFID); SUBSTRATES; WIRELESS TELECOMMUNICATION SYSTEMS;

PAPER CONTAINERS;

COST EFFECTIVENESS; DESIGN; DIELECTRICS; FREQUENCY; LASERS; NETWORKS; PACKAGING; PAPER PRODUCTS; PARAMETERS; SUBSTRATES; TELECOMMUNICATIONS;

EID: 51349129819     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549998     Document Type: Conference Paper

References (4)

1. K. Finkenzeller, RFID Handbook, 2nd ed., Wiley, 2004.
2. L. Yang, A. Rida, R. Vyas, M. M. Tentzeris, "RFID Tag and RF Structures on a Paper Substrate Using Inkjet-Printing Technology," Microwave Theory and Techniques, IEEE Transactions on Volume 55, Issue 12, Part 2, Dec. 2007 Page(s):2894 - 2901
3. K. Virga, Y. Rahmat-Samii, "Low-profile Enhanced-Bandwidth PIFA Antennas for Wireless Communications Packaging," Microwave Theory and Techniques, IEEE Trans.,pp 1879-1888, vol. 45, No. 10, 1997.
4. P. Salonen, M. Keskilammi, and M. Kivikoski, "Single-Feed Dual-Band Planar Inverted-F Antenna with U-shaped slot," Antennas and Propagation, IEEE Trans., pp. 1262-1264, vol. 48, No. 8, 2000.