Cooling approaches for high power diode laser bars

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1011-1016

  Leers, Michael ^a   Boucke, Konstantin ^a  

^a FRAUNHOFER INSTITUTE FOR LASER TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPUTER NETWORKS; COPPER; DC GENERATORS; DIODES; LASER BEAM WELDING; LASERS; LEAD; MIXED CONVECTION; STANDARDIZATION; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY; WELDING;

CONDUCTIVELY COOLED; LASER BARS;

THERMAL EXPANSION;

EID: 51349127418     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550100     Document Type: Conference Paper

References (4)

1. M. Leers et al, Expansion-matched passivley cooled heat sinks with low thermal resistance for high-power diode laser bars, SPIE Proceedings Vol. 6104, pp. 20-29, 2006.
2. Th. Westphalen, Untersuchungen von Hochleistungs-Diodenlaserbarren mittels Einzelemitter aufgelöster Charakterisierung, Diploma thesis, RWTH Aachen, 2006
3. J. Tomm, Quantum-Well Laser Array Packaging, McGraw-Hill Professional, New York, 2006
4. Ch. Scholz, Thermal and mechanical optimization of diode laser bar packaging, Ph.D. thesis, RWTH Aachen, 2007