10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 250-255

  Suzuki, Atsushi ^a   Ishikawa, Takaaki ^a   Wakazono, Yoshitsugu ^a   Nagao, Daisuke ^a   Hino, Tomoyuki ^a   Hashimoto, Yoichi ^a   Masuda, Hiroshi ^a   Suzuki, Shuji ^a   Tamura, Mitsuaki ^a   Suzuki, Tei Ichi ^a   Kikuchi, Katsuya ^a   Okada, Yoshikuni ^a   Nakagawa, Hiroshi ^a   Aoyaghi, Masahiro ^a   Mikawa, Takashi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER NETWORKS; CONDUCTIVE FILMS; CONNECTORS (STRUCTURAL); ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; FABRICATION; FIBERS; INDUSTRIAL ENGINEERING; OPTICAL DEVICES; OPTICAL FIBER COUPLING; OPTICAL FIBER FABRICATION; OPTICAL FIBERS; OPTICAL INSTRUMENTS; OPTICAL INTERCONNECTS; OPTICAL MATERIALS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SUBSTRATES;

CERAMIC SUBSTRATES; OPTICAL MODULES;

PRINTED CIRCUIT BOARDS;

EID: 51349117895     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549978     Document Type: Conference Paper

References (16)

1. th Electronic Components and Technology Conf. (ECTC), Reno, NV, May 2007, pp. 1262-1267.
2. nd Eur. Conf. Optical Commun. (ECOC), Cannes, France, Sep. 2006, Paper We.4.2.3.
3. Suzuki, A., Suzuki, K., Wakazono, Y., Suzuki, S., Yamaguchi, T., Masuda, H., Saito, K., Kinoshita, M., Ibaragi, O., Kikuchi, K., Nakagawa, H., Okada, Y., and Aoyagi, M., "Signal transmission evaluation of optical backplane model with 10-Gbit/s optical transmitter and receiver module," IEICE Trans. Electron. (Japanese Edition), Vol. J89-C, No. 11 Nov., (2007), pp. 796-808, In Japanese.
4. th Electron. Packag. Technol. Conf. (EPTC), Sigapore, Dec. 2007, pp. 375-379.
5. Miyoshi, H., Hatakeyama, I., Sasaki, J., Yamamoto, K., Kurihara, M., Watanabe, T., Ushioda, J., Hashimoto, Y., Kuribayashi, R., and Kurata, K., "A 400Gb/s backplane switch with 10Gbps/port optical I/O interfaces based on OIP (optical interconnection as IP of a CMOS library)," Proc. of Optical Fiber Communication Conference and Exposition (OFC), Anahaim, CA, Mar. 2005, Paper OWB1.
6. Hatakeyama, I., Miyoshi, K., Sasaki, J., Yamamoto, K., Kurihara, M., Watanabe, T., Ushioda, J., Hashimoto, Y., Kuribayashi, R., Kurata, K., "A 400Gb/s backplane switch with 10Gbps/port optical I/O interfaces," Proc. of SPIE Active and Passive Optical Components for WDM Communications V (Proceedings Volume), vol. 6014, pp.60140J-1-60140J-7.
7. Yoon, K. B., Cho, I. -K., Ahn, S. H., Jeong, M. Y., Lee, D. J., Heo, Y. U., Rho, B. S., Park, H. -H., Rhee, B. -H., "Optical backplane system using waveguide-embedded PCBs and optical slots," J. Lightw. Technol., Vol. 22, No. 9 (2004), pp. 2119-2127.
8. Cook, C., Cunningham, J. E., Hargrove, A., Ger, G. G., Goossen, K. W., Jan, W. Y., Kim, H. H., Krause, R., Manges, M., Morrissey, M., Perinpanayagam, M., Persaud, A., Shevchuk, G. J., Sinyansky, V., and Krishinamoorthy, A. V., "A 36-channel parallel optical interconnect module based on optoelectronics-on-VLSI technology," IEEE J. Sci Topics Quantum Electron., Vol. 9, No. 2 (2003), pp. 387-399.
9. Benner, A. F., Ignatowski, M., Kash, J. A., Kuchta, D. M., Ritter, M. B., "Exploitation of optical interconnects in future server architectures," IBM J. Res. & Dev., Vol. 49, No. 4/5 July/Sept., (2005), pp. 755-775.
10. AdvancedTCA™, PICMG 3.0, Short Form Specification, Jan 2003. [Online]. Available: http://www.picmg.org/pdf/PICMG_3_0_Shortform.pdf
11. [Online]. Available: http://www.popoptics.org/
12. Ishikawa, T., Suzuki, A., Wakazono, Y., Nagao, D., Hino, T., Hashimoto, Y., Masuda, H., Suzuki, S., Tamura, M., Suzuki, T., Kikuchi, K., Okada, Y., Nakagawa, H., Aoyagi, M., and Mikawa, T., "High-density and low-cost 10-Gbps × 12ch optical modules for high-end optical interconnect applications," Proc. of Optical Fiber Communication Conference and Exposition (OFC), San Diego, CA, Feb. 2008, paper OMK6.
13. th Electronic Components and Technology Conf. (ECTC), Reno, NV, May 2007, pp. 1275-1280.
14. th International Symposium on Microelectronics (IMAPS), Long Beach, CA, Nov. 2004, Paper THA2.
15. Ohno, T., Takagi, Y., Horio, T., Kunda, S., Suzuki, A., Takada, T., Okuyama, M., and Obayashi, K., "Optical interconnection module using ceramic package as alignment arrangement," IEICE Trans. Electron. (Japanese Edition), Vol. J90-C, No. 11 Nov., (2007), pp. 775-784, In Japanese.
16. Wakazono, Y., Suzuki, A., Nagao, D., Ishikawa, T., Hino, T., Hashimoto, Y., Masuda, H., Suzuki, S., Tamura, M., Suzuki, T., Kikuchi, K., Nakagawa, H., Aoyagi, M., Mikawa, T., "A study on coupling efficiency between VCSEL and 45°-angled mirror component for low-cost and high-density 10Gbps/ch optical parallel link module," Proc. 20th Annu. Meeting of the IEEE Lasers and Electro-Optics Society (LEOS), Lake Buena Vista, FL, Oct. 2007, pp.678-679, Paper WEE6.