50μm pitch Pb-free micro-bumps by C4NP technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1505-1510

  Dang, Bing ^a   Shih, Da Yuan ^a   Buchwalter, Stephen ^a   Tsang, Cornelia ^a   Patel, Chirag ^a   Knickerbocker, John ^a   Gruber, Peter ^a   Knickerbocker, Sarah ^b   Garant, John ^b   Semkow, Krystyna ^b   Ruhmer, Klaus ^c   Hughlett, Emmett ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c SUSS MicroTec Lithography GmbH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICRO-BUMPS; PB-FREE;

COMPUTER NETWORKS; COMPUTER SOFTWARE REUSABILITY; LEAD; LEAD ALLOYS; MANUFACTURE; MOLDS; OPTIMIZATION;

PROCESS CONTROL;

EID: 51349107972     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550175     Document Type: Conference Paper

References (5)

1. International Technology Roadmap for Semiconductors, Assembly and Packaging, 2006.
2. V. Kripesh, et al., "Ultra-Fine Pitch Pb-free & Eutectic Solder Bumping with Fine Particle Size Solder Paste for Nano Packaging," ECTC, 2003.
3. Miller, L. F., "Controlled Collapse Reflow Chip Joining," IBM J. Res. Dev., 13, 1969,
4. H. Gan, et al., "Pb-free Micro-joints (50 μm pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization," ECTC, San Diego, may/June 2006.
5. E.Laine, et al., "C4NP Technology for Lead Free Solder Bumping," ECTC 2007, Reno, NV, May/June 2007.