Tribological performance of Cu-Ni alloy nanoparticles synthesized using a pulsed-wire evaporation method

Metals and Materials International

Volumn 14, Issue 4, 2008, Pages 425-432

  Oh, Jeongseok ^a   Rhee, Changkyu ^b  

^a Pusan National University   (South Korea)

^b Korea Atomic Energy Research Institute   (South Korea)

Author keywords

Cu Ni alloy; Dispersion stability; Nanoparticles; Pulsed wire evaporation; Tribological

Indexed keywords

BINARY ALLOYS; COPPER METALLOGRAPHY; DISPERSIONS; ENERGY DISPERSIVE SPECTROSCOPY; EVAPORATION; FRICTION; NANOPARTICLES; NICKEL ALLOYS; NICKEL METALLOGRAPHY; ROLLING; SCANNING ELECTRON MICROSCOPY; SOLID LUBRICANTS; STABILITY; SYNTHESIS (CHEMICAL); TRIBOLOGY; WEAR RESISTANCE; WIRE;

BACK-SCATTERING PROFILES; CU -NI ALLOYS; DISPERSION STABILITY; ENERGY DISPERSIVE X RAY SPECTROSCOPY; LOW FRICTION COEFFICIENTS; PULSED WIRE EVAPORATION METHODS; PULSED WIRE EVAPORATIONS; TRIBOLOGICAL;

COPPER ALLOYS;

EID: 51349107824     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.3365/met.mat.2008.08.425     Document Type: Article

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