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Metallurgical and Materials Transactions A

Volumn 25, Issue 4, 1994, Pages 839-850

Coefficients of thermal expansion of metal-matrix composites for electronic packaging

(3) Shen, Y L a Needleman, A a Suresh, S b

a BROWN UNIVERSITY (United States)

b MASSACHUSETTS INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; DUCTILITY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTICITY; RESIDUAL STRESSES; STRAIN; THERMAL EXPANSION;

AXISYMMETRIC UNIT CELL MODELS; COEFFICIENT OF THERMAL EXPANSION (CTE); REINFORCEMENT VOLUME FRACTIONS; TWO DIMENSIONAL PLANE STRAIN;

METALLIC MATRIX COMPOSITES;

EID: 51249163530 PISSN: 10735623 EISSN: 15431940 Source Type: Journal
DOI: 10.1007/BF02665460 Document Type: Article

Times cited : (140)

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