Quantitative analysis of correlation between insulator surface copper contamination and TDDB lifetime based on actual measurement

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 222-224

  Oshida, D ^a   Takewaki, T ^a   Iguchi, M ^a   Taiji, T ^a   Morita, T ^a   Tsuchiya, Y ^a   Tsuchiya, H ^a   Yokogawa, S ^a   Kunishima, H ^a   Aizawa, H ^a   Okada, N ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHELATION; CHLORINE COMPOUNDS; COMPUTER NETWORKS; CONTAMINATION; CORRELATION METHODS; INSULATING MATERIALS; NANOTECHNOLOGY;

COPPER CONTAMINATION; TDDB LIFETIME;

COPPER COMPOUNDS;

EID: 50949120440     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546973     Document Type: Conference Paper

References (4)

1. S. Yokogawa, et al., Proc. of 2008 IRPS, to be published.
2. J. Noguchi, et al., IEEE trans. on Electron Devices, (2005).
3. M.Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, NACE, Houston (1966).
4. F. Chen, et al., Proc. of 2007 IRPS, pp.382-389 (2007).