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Volumn 495, Issue 1-2, 2008, Pages 3-7
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Effect of Cu and Sn on liquid-liquid interfacial energy in ternary and quaternary Al-Bi-based monotectic alloys
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Author keywords
Adsorption; Interfacial tension; Monotectic alloys
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Indexed keywords
ALUMINUM ALLOYS;
BINARY ALLOYS;
BISMUTH ALLOYS;
COPPER;
INTERFACIAL ENERGY;
LIQUIDS;
TIN;
BI-BASED;
HIGHEST TEMPERATURE;
LIQUID INTERFACIAL ENERGY;
LIQUID LIQUID INTERFACIAL TENSION;
LIQUID-LIQUIDS;
MONOTECTIC ALLOY;
TEMPERATURE DEPENDENCE;
TENSION AT LOWER TEMPERATURE;
TEMPERATURE DISTRIBUTION;
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EID: 50949115017
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2007.08.097 Document Type: Article |
Times cited : (22)
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References (16)
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