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Volumn 29, Issue 4, 2008, Pages 1422-1438

In-plane thermal diffusivity measurement of thin samples using a transient fin model and infrared thermography

Author keywords

IR camera; Solid material; Thermal conductivity; Thermal diffusivity; Thermal imaging

Indexed keywords

IR CAMERA; SOLID MATERIAL; THERMAL CONDUCTIVITY; THERMAL DIFFUSIVITY; THERMAL IMAGING;

EID: 50949101720     PISSN: 0195928X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10765-008-0498-6     Document Type: Article
Times cited : (10)

References (9)
  • 7
    • 0003238961 scopus 로고
    • Properties of copper and copper alloys at cryogenic temperatures
    • N.J. Simon, E.S. Drexler, R.P. Reed, Properties of copper and copper alloys at cryogenic temperatures. NIST Monograph 177 (1992)
    • (1992) NIST Monograph , vol.177
    • Simon, N.J.1    Drexler, E.S.2    Reed, R.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.