Data center TCO benefits of reduced system airflow

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 1199-1202

  Malone, Christopher G ^a   Vinson, Wade ^b   Bash, Cullen E ^b  

^a GOOGLE INC   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

Author keywords

Airflow management; Data center thermal management; IT equipment energy efficiency

Indexed keywords

COMPUTER NETWORKS; ELECTRONICS ENGINEERING; ENERGY CONSERVATION; FIGHTER AIRCRAFT; FORMING; MACHINE DESIGN; SATELLITE COMMUNICATION SYSTEMS; THERMOMECHANICAL TREATMENT;

AIR FLOW RATES; AIRFLOW MANAGEMENT; DATA CENTER THERMAL MANAGEMENT; ELECTRONIC SYSTEMS; IT EQUIPMENT ENERGY EFFICIENCY;

DATA REDUCTION;

EID: 50949091619     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544397     Document Type: Conference Paper

References (5)

1. Malone, C.G., Belady, C., 2008, "Optimizing Data Center TCO: Efficiency Metrics and an Infrastructure Cost Model," to appear in the Proceedings of the ASHRAE 2008 Winter Meeting, New York City, NY.
2. IDC, 2006, "Forecasting Total Cost of Ownership for Initial Deployments of Server Blades," ftp://ftp.compaq.com/pub/products/servers/ blades/idc-tcodeployment.pdf.
3. Sine Nomine Associates, "A Comparison of HP BladeSystem with Thermal Logic Technologies to Competitive Systems, HP-2360-02 February 15, 2007.
4. Bash, C.E., Patel, C.D., Sharma, R.K., 2006, "Dynamic Thermal Management of Air Cooled Data Centers," Proceedings of ITherm 2006, San Diego, CA.
5. Bash, C. E., 2001, "Analysis of Refrigerated Loops for Electronics Cooling", Proceedings of IPACK'01, Kauai, Hawaii.