Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model

International Journal of Adhesion and Adhesives

Volumn 29, Issue 1, 2009, Pages 67-76

  Diaz Diaz, Alberto ^a   Hadj Ahmed, Réda ^b   Foret, Gilles ^b   Ehrlacher, Alain ^b  

^a CENTRO DE INVESTIGACIÓN EN MATERIALES AVANZADOS   (Mexico)

^b UNIVERSITÉ PARIS EST   (France)

Author keywords

Layerwise model; Peal; Stress analysis

Indexed keywords

ADHESIVE JOINTS; MODAL ANALYSIS; MOLECULAR BEAM EPITAXY; PLATES (STRUCTURAL COMPONENTS); STRENGTH OF MATERIALS; STRESS ANALYSIS;

ADHERENDS; ADHESIVE THICKNESS; ADHESIVELY BONDED JOINTS; ANALYTICAL METHODS; BONDED JOINTS; DOUBLE LAP JOINT; FINITE-ELEMENT CALCULATIONS; LAYER THICKNESSES; LAYERWISE MODEL; MODEL RESULTS; PEAL; REISSNER-MINDLIN PLATES;

FINITE ELEMENT METHOD;

EID: 50849121701     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2008.01.004     Document Type: Article

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