Precision removal of ITO layer using plate-form tool design

Journal of Solid State Electrochemistry

Volumn 12, Issue 11, 2008, Pages 1445-1451

  Pa, P S ^a  

^a NATIONAL TAIPEI UNIVERSITY OF EDUCATION   (Taiwan)

Author keywords

Design recycle; ITO; Microstructure; Plate form tool; Semiconductor

Indexed keywords

COLOR FILTER; DEFECT RATES; DESIGN FEATURES; DESIGN RECYCLE; ELECTRIC POWERS; ELECTRICAL CURRENT; ELECTRO-CHEMICAL MACHINING; FEED RATES; FILM MICROSTRUCTURES; HIGH FLOW VELOCITY; ITO; MICROSTRUCTURE; OPTOELECTRONIC INDUSTRY; PLATE-FORM TOOL; PRODUCTION COSTS; PULSED DIRECT CURRENT; RECYCLING PROCESSES; REMOVAL PROCESSES; ROTATIONAL SPEEDS; SEMICONDUCTOR; SEMICONDUCTOR TECHNIQUES; TFT-LCD; TH GENERATION; THIN PLATES; TOOL DESIGNS; TOOL ELECTRODES; WORK PIECES;

AIR FILTERS; DISCHARGE (FLUID MECHANICS); ELECTRIC CONDUCTIVITY; ELECTRIC DISCHARGE MACHINING; ELECTRIC DISCHARGES; ELECTROCHEMICAL CUTTING; ELECTRODES; ELECTROLYSIS; EXPERIMENTS; MACHINING; METALLIZING; RECYCLING; SEMICONDUCTOR MATERIALS; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TURBULENT FLOW; WAVE FILTERS;

ELECTROCHEMICAL ELECTRODES;

EID: 50649118039     PISSN: 14328488     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10008-007-0492-0     Document Type: Article

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