A low-power integrated neural interface with digital spike detection and isolation

Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems

Volumn , Issue , 2007, Pages 1412-1415

  Gosselin, Benoit ^a,b   Sawan, Mohamad ^a,b  

^a IEEE

^b ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

MULTI CHANNELS; NEURAL INTERFACES;

DIGITAL ARITHMETIC;

EID: 50649112125     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICECS.2007.4511264     Document Type: Conference Paper

References (7)

1. R. H. Olsson, III and K. D. Wise, "A three-dimensional neural recording microsystem with implantable data compression circuitry," IEEE Journal of Solid-State Circuits, vol. 40, pp. 2796-2804, 2005.
2. R. R. Harrison, et al., "A Low-Power Integrated Circuit for a Wireless 100-Electrode Neural Recording System," IEEE Journal of Solid-State Circuits, vol. 42, pp. 123-133, 2007.
3. Y. Perelman and R. Ginosar, "An Integrated System for Multichannel Neuronal Recording With Spike/LFP Separation, Integrated A/D Conversion and Threshold Detection," IEEE Transactions on Biomedical Engineering, vol. 54, pp. 130-137, 2007.
4. A. E. Ayoub, B. Gosselin, and M. Sawan, "A Microsystem Integration Platform Dedicated to Build Multi-Chip Neural Interfaces," submitted for publication in The 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2007.
5. B. Gosselin, M. Sawan, and C. A. Chapman, "A Low-Power Integrated Bioamplifier With a New DC Rejection Scheme," IEEE Transactions on Biomedical Circuits and Systems, (pending review), 2007.
6. P.-Y. Robert, B. Gosselin, and M. Sawan, "An Ultra-Low-Power Successive-Approximation-Based ADC for Implantable Sensing Devices," in The 2006 Midwest Symp. Circ. and Syst., 2006.
7. Z. S. Zumsteg, et al., "Power feasibility of implantable digital spike sorting circuits for neural prosthetic systems," IEEE Trans. on Neural Systems and Rehabilitation Engineering, vol. 13, pp. 272-279, 2005.