Deposition of thin films of Ni-P and Ni-B-P by dynamic chemical plating

Journal of Alloys and Compounds

Volumn 466, Issue 1-2, 2008, Pages 391-397

  Stremsdoerfer, G ^a   Omidvar, H ^b   Roux, P ^a   Meas, Y ^c   Ortega Borges, R ^c  

^a ECOLE CENTRALE DE LYON   (France)

^b AMIRKABIR UNIVERSITY OF TECHNOLOGY   (Iran)

^c CENTRO DE INVESTIGACIÓN Y DESARROLLO TECNOLÓGICO EN ELECTROQUÍMICA   (Mexico)

Author keywords

Dynamic chemical plating; Electroless deposition; Ni P alloys; Ni P B alloys; Nickel binary and ternary alloys plating

Indexed keywords

ALLOYS; BINARY ALLOYS; COPPER; DEPOSITION; MAGNETIC PROPERTIES; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; METALS; NICKEL; SILVER; SODIUM; THICK FILMS;

CHEMICAL NATURE; DEPOSITED ALLOYS; DEPOSITION CONDITIONS; DYNAMIC CHEMICAL PLATING; ELECTROLESS DEPOSITION; HOMOGENEOUS DEPOSITS; NI-P ALLOYS; NI-P-B ALLOYS; NICKEL BINARY AND TERNARY ALLOYS PLATING; TECHNOLOGICAL APPLICATIONS; THIN FILMS; WET-DEPOSITION;

NICKEL ALLOYS;

EID: 50649097180     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.11.052     Document Type: Article

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