SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 49, Issue 7, 2008, Pages 1518-1523

Effect of Ni or Co addition to Sn-Ag solder on microstructure and joint strength at interface

(3) Nishikawa, Hiroshi a Komatsu, Akira b,c Takemoto, Tadashi a

a OSAKA UNIVERSITY (Japan)

b OSAKA UNIVERSITY (Japan)

c TOSHIBA CORPORATION (Japan)

Author keywords

Interface; Intermetallic compound; Joint strength; Lead free solder; Microstructure; Minor element addition

Indexed keywords

AGING OF MATERIALS; BRAZING; COMPUTER NETWORKS; COPPER; METALLIC COMPOUNDS; METALLIZING; MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; WELDING;

INTERFACE; INTERMETALLIC COMPOUND; JOINT STRENGTH; LEAD-FREE SOLDER; MINOR ELEMENT ADDITION;

TIN;

EID: 50549104357 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.MF200851 Document Type: Article

Times cited : (11)

References (24)

1
- 50549100513
- Official Journal of the European Union, February 13, (2003), L37/ 19-L37/23L37/24-L37/38.
- Official Journal of the European Union, February 13, (2003), L37/ 19-L37/23L37/24-L37/38.

2
- 0000324593
- T. Takemoto: Materia Japan 35 (1996) 320-325.
- (1996) Materia Japan , vol.35 , pp. 320-325
- Takemoto, T.¹

3
- 4344620575
- T. Takemoto: J. Japan Weld Soc. 69 (2000) 100-107.
- (2000) J. Japan Weld Soc , vol.69 , pp. 100-107
- Takemoto, T.¹

4
- 0034944989
- T. Takemoto and M. Miyazaki: Mater. Trans. 42 (2001) 745-750.
- (2001) Mater. Trans , vol.42 , pp. 745-750
- Takemoto, T.¹ Miyazaki, M.²

5
- 0034946833
- S. H. Huh, K. S. Kim and K. Suganuma: Mater. Trans. 42 (2001) 739-744.
- (2001) Mater. Trans , vol.42 , pp. 739-744
- Huh, S.H.¹ Kim, K.S.² Suganuma, K.³

6
- 0034944095
- W. K. Choi, S. W. Yoon and H. M. Lee: Mater. Trans. 42 (2001) 783-789.
- (2001) Mater. Trans , vol.42 , pp. 783-789
- Choi, W.K.¹ Yoon, S.W.² Lee, H.M.³

7
- 0035454949
- S. W. Chen and Y. W. Yen: J. Electron. Mater. 30 (2001) 1133-1137.
- (2001) J. Electron. Mater , vol.30 , pp. 1133-1137
- Chen, S.W.¹ Yen, Y.W.²

8
- 0041861080
- J. W. Yoon and S. B Jung: J. Alloys Compd. 359 (2003) 202-208.
- (2003) J. Alloys Compd , vol.359 , pp. 202-208
- Yoon, J.W.¹ Jung, S.B.²

9
- 0036698703
- T. Takemoto and T. Funaki: Mater. Trans. 43 (2002) 1784-1790.
- (2002) Mater. Trans , vol.43 , pp. 1784-1790
- Takemoto, T.¹ Funaki, T.²

10
- 0036699303
- I. Shohji, T. Nakamura, F. Mori and S. Fujiuchi: Mater. Trans. 43 (2002) 1797-1801.
- (2002) Mater. Trans , vol.43 , pp. 1797-1801
- Shohji, I.¹ Nakamura, T.² Mori, F.³ Fujiuchi, S.⁴

11
- 9144223777
- T. Takemoto, T. Uetani and M. Yamazaki: Soldering & Surf. Mount Technol. 16 (2004) 9-15.
- (2004) Soldering & Surf. Mount Technol , vol.16 , pp. 9-15
- Takemoto, T.¹ Uetani, T.² Yamazaki, M.³

12
- 2442604462
- H. Nishikawa, T. Takemoto, K. Kifune, T. Uetani and N. Sekimori: Mater. Trans. 45 (2004) 741-746.
- (2004) Mater. Trans , vol.45 , pp. 741-746
- Nishikawa, H.¹ Takemoto, T.² Kifune, K.³ Uetani, T.⁴ Sekimori, N.⁵

13
- 30844439462
- H. Nishikawa, A. Komatsu and T. Takemoto: Mater. Trans. 46 (2005) 2394-2399.
- (2005) Mater. Trans , vol.46 , pp. 2394-2399
- Nishikawa, H.¹ Komatsu, A.² Takemoto, T.³

14
- 0034944095
- W. K. Choi, S. W. Yoon and H. M. Less: Mater. Trans. 42 (2001) 783-789.
- (2001) Mater. Trans , vol.42 , pp. 783-789
- Choi, W.K.¹ Yoon, S.W.² Less, H.M.³

15
- 0035455514
- 1
- 1. E. Anderson, J. C. Foley, B. A. Cook, J. Harringa, R. L. Terpstra and O. Unal: J. Electron. Mater. 30 (2001) 1050-1059.
- (2001) J. Electron. Mater , vol.30 , pp. 1050-1059
- Anderson, E.¹ Foley, J.C.² Cook, B.A.³ Harringa, J.⁴ Terpstra, R.L.⁵ Unal, O.⁶

16
- 0942277781
- C. M. Chuang and K. L. Lin: J. Electron Mater. 32 (2003) 1426-1431.
- (2003) J. Electron Mater , vol.32 , pp. 1426-1431
- Chuang, C.M.¹ Lin, K.L.²

17
- 33644893068
- T. H. Chuang, S. F. Yen and M. D. Cheng: J. Electron. Mater. 35 (2006) 302-309.
- (2006) J. Electron. Mater , vol.35 , pp. 302-309
- Chuang, T.H.¹ Yen, S.F.² Cheng, M.D.³

18
- 32644433186
- C. M. T. Law, C. M. L. Wu, D. Q. Yu. L. Wang and J. K. L. Lai: J. Electron. Mater. 35 (2006) 89-93.
- (2006) J. Electron. Mater , vol.35 , pp. 89-93
- Law, C.M.T.¹ Wu, C.M.L.² Wang, D.Q.Y.L.³ Lai, J.K.L.⁴

19
- 33645571600
- S. T. Kao, Y. C. Lin and J. G. Duh: J. Electron. Mater. 35 (2006) 486-493.
- (2006) J. Electron. Mater , vol.35 , pp. 486-493
- Kao, S.T.¹ Lin, Y.C.² Duh, J.G.³

20
- 33645566980
- S. K. Kang, D. Leonard, D. Y. Shin, L. Gignac, D. W. Henderson, S. Cho and J. Yu: J. Electron. Mater. 35 (2006) 479-485.
- (2006) J. Electron. Mater , vol.35 , pp. 479-485
- Kang, S.K.¹ Leonard, D.² Shin, D.Y.³ Gignac, L.⁴ Henderson, D.W.⁵ Cho, S.⁶ Yu, J.⁷

21
- 0002378591
- Y. C. Chan, A. C. K. So and J. K. L. Lai: Mater. Sci. Eng. B 55 (1998) 5-13.
- (1998) Mater. Sci. Eng. B , vol.55 , pp. 5-13
- Chan, Y.C.¹ So, A.C.K.² Lai, J.K.L.³

22
- 0036642259
- M. O. Alam, Y. C. Chan and K. C. Hung: Microelectronics Reliability 42 (2002) 1065-1073.
- (2002) Microelectronics Reliability , vol.42 , pp. 1065-1073
- Alam, M.O.¹ Chan, Y.C.² Hung, K.C.³

23
- 28044468188
- J. M. Koo and S. B. Jung: Microelectronic Eng. 82 (2005) 569-574.
- (2005) Microelectronic Eng , vol.82 , pp. 569-574
- Koo, J.M.¹ Jung, S.B.²

24
- 33745029082
- F. Gao, T. Takemoto, H. Nishikawa and A. Komatsu: J. Electron Mater. 35 (2006) 905-911.
- (2006) J. Electron Mater , vol.35 , pp. 905-911
- Gao, F.¹ Takemoto, T.² Nishikawa, H.³ Komatsu, A.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.