A MEMS inertia switch with bridge-type elastic fixed electrode for long duration contact

IEEE Transactions on Electron Devices

Volumn 55, Issue 9, 2008, Pages 2492-2497

  Yang, Zhuoqing ^a   Ding, Guifu ^a   Cai, Haogang ^a   Zhao, Xiaolin ^a  

^a Shanghai Jiao Tong University   (China)

Author keywords

Contact dynamics simulation; Dropping test; Inertia switch; Microelectromechanical system (MEMS); Surface micromachining

Indexed keywords

COMPUTER NETWORKS;

CONTACT DYNAMICS SIMULATION; DROPPING TEST; INERTIA SWITCH; MICROELECTROMECHANICAL SYSTEM (MEMS); SURFACE MICROMACHINING;

ELECTROLYSIS;

EID: 50549091729     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2008.927385     Document Type: Article

References (14)

1. S. Michaelis, H.-J. Timme, M. Wycisk, and J. Binder, "Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications," J. Micromech. Microeng., vol. 10, no. 2, pp. 120-123, Jun. 2000.
2. L. Zimmermann, J. P. Ebersohl, F. Le Hung, J. P. Berry, F. Baillieu, P. Rey, B. Diem, S. Renard, and P. Caillat, "Airbag application: A microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronics and true self-test capability," Sens. Actuators A, Phys., vol. 46, no. 1-3, pp. 190-195, Jan. 1995.
3. T. Tønnesen, O. Lüdtke, J. Noetzel, J. Binder, and G. Mader, "Simulation, design and fabrication of electroplated acceleration switches," J. Micromech. Microeng., vol. 7, no. 3, pp. 237-239, Sep. 1997.
4. M. Wycisk, T. Tönnesen, J. Binder, S. Michaelis, and H.-J. Timme, "Low-cost post-CMOS integration of electroplated microstructures for inertial sensing," Sens. Actuators A, Phys., vol. 83, no. 1-3, pp. 93-100, May 2000.
5. W. D. Frobenius, S. A. Zeitman, M. H. White, D. D. O'Sullivan, and R. G. Hamel, "Microminiature ganged threshold accelerometers compatible with integrated circuit technology," IEEE Trans. Electron Devices, vol. ED-19, no. 1, pp. 37-40, Jan. 1972.
6. P. M. Zavracky, S. Majumder, and N. E. McGruer, "Micromechanical switches fabricated using nickel surface micromachining," J. Microelectromech. Syst., vol. 6, no. 1, pp. 3-9, Mar. 1997.
7. T.-R. Hsu, MEMS & Microsystems: Design and Manufacture. Beijing, China: McGraw-Hill, 2002, pp. 56-59.
8. G. T. A. Kovacs, Micromachined Transducers Sourcebook. Beijing, China: McGraw-Hill, 1998, pp. 163-169.
9. J. S. Go, Y.-H. Cho, B. M. Kwak, and K. Park, "Snapping microswitches with adjustable acceleration threshold," Sens. Actuators A, Phys. vol. 54, no. 1-3, pp. 579-583, Jun. 1996.
10. Y. Loke, G. H. McKinnon, and M. J. Brett, "Fabrication and characterization of silicon micromachined threshold accelerometers," Sens. Actuators A, Phys., vol. 29, no. 3, pp. 235-240, Dec. 1991.
11. M. Jia, X. Li, Z. Song, M. Bao, Y. Wang, and H. Yang, "Micro-cantilever shocking-acceleration switches with threshold adjusting and "on"-state latching functions," J. Micromech. Microeng., vol. 17, no. 3, pp. 567-575, Mar. 2007.
12. W. Ma, Y. Zohar, and M. Wong, "Design and characterization of inertia-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology," J. Micromech. Microeng., vol. 13, no. 6, pp. 892-899, Nov. 2003.
13. T. Matsunaga and M. Esashi, "Acceleration switch with extended holding time using squeeze film effect for side airbag systems," Sens. Actuators A, Phys., vol. 100, no. 1, pp. 10-17, Aug. 2002.
14. W. Ma, G. Li, Y. Zohar, and M. Wong, "Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology," Sens. Actuators A, Phys., vol. 111, no. 1, pp. 63-70, Mar. 2004.