Manufacturable low keff (Keff<2.5) Cu interconnects by selective / low damage air gap formation

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 15-17

  Harada, T ^a   Takahashi, M ^b   Murakami, K ^b   Korogi, H ^a   Sasaki, T ^b   Hattori, T ^a   Ogawa, S ^a   Ueda, T ^a  

^a PANASONIC CORPORATION   (Japan)

^b Panasonic Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; GALLIUM ALLOYS; OPTICAL INTERCONNECTS; SULFATE MINERALS; TEMPERATURE CONTROL;

AIR GAP FORMATION; AIR GAPS; CU INTERCONNECTS; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; LOW DAMAGES; NEW TECHNOLOGIES;

TECHNOLOGY;

EID: 50249182956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648633     Document Type: Conference Paper

References (7)

1. N. Matsunaga et al., IITC, 2005.
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3. J. Noguchi et al., IITC, 2003.
4. S. Uno et. al., IITC, 2005.
5. K. Schulze et. al., AMC, 2005.
6. T. Ueda et. al., VLSI Symp. 1998.
7. C. K. Hu et al., Appl. Phys. Lett., 81(10), 2002, p. 178.