Virtual remaining life assessment of electronic hardware subjected to shock and random vibration life cycle loads

Journal of the IEST

Volumn 50, Issue 1, 2007, Pages 86-97

  Mathew, Sony ^a   Das, Diganta ^a   Osterman, Michael ^a   Pecht, Michael ^a   Ferebee, Robin ^b   Clayton, Joseph ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b NASA MARSHALL SPACE FLIGHT CENTER   (United States)

^c BD Systems Inc

Author keywords

Damage; Life cycle; Random vibration; Remaining life; Shock; Solder interconnects

Indexed keywords

BOOSTERS (ROCKET); ROCKETS; SOLDERING ALLOYS; SPACE SHUTTLES;

DAMAGE; RANDOM VIBRATIONS; REMAINING LIFE; SHOCK; SOLDER INTERCONNECTS;

LIFE CYCLE;

EID: 50249147283     PISSN: 10984321     EISSN: None     Source Type: Journal    
DOI: 10.17764/jiet.50.1.l5721m6160258l22     Document Type: Article

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