Control of plasma uniformity using phase difference in a VHF plasma process chamber

IEEE Transactions on Plasma Science

Volumn 36, Issue 4 PART 1, 2008, Pages 1366-1367

  Bera, Kallol ^a   Rauf, Shahid ^a   Collins, Ken ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

Capacitively coupled; Plasma density; Plasma uniformity; Power deposition; VHF Plasma; Voltage phase difference

Indexed keywords

CHEMICAL BONDS; ELECTROCHEMICAL PROPERTIES; ELECTRONEGATIVITY; INDUCTIVELY COUPLED PLASMA; INDUSTRIAL ENGINEERING; PLASMA APPLICATIONS;

BOTTOM ELECTRODES; CAPACITIVELY COUPLED; CAPACITIVELY COUPLED PLASMA; LOAD CONDITIONS; PHASE DIFFERENCES; PLASMA DENSITY; PLASMA SCIENCE; PLASMA UNIFORMITY; POWER DEPOSITION; SEMICONDUCTOR MANUFACTURING PROCESSES; VERY HIGH-FREQUENCY; VHF PLASMA; VOLTAGE PHASE; VOLTAGE PHASE DIFFERENCE;

PLASMAS;

EID: 50249140276     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2008.924413     Document Type: Article

References (2)

1. M. A. Lieberman, J. P. Booth, P. Chabert, J. M. Rax, and M. M. Turner, "Standing wave and skin effects in large-area, high-frequency capacitive discharges," Plasma Sources Sci. Technol., vol. 11, no. 3, pp. 283-293, Jun. 2002.
2. S. Rauf, "Dual radio frequency sources in a magnetized capacitively coupled plasma discharge," IEEE Trans. Plasma Sci., vol. 31, no. 4, pp. 471-478, Aug. 2003.