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Volumn , Issue , 2008, Pages 850-853
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Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation
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Author keywords
3D microstructure; Dielectrophoretic; Micro bead
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Indexed keywords
ELECTRIC CONDUCTIVITY;
ELECTRIC FIELDS;
ELECTRIC NETWORK ANALYSIS;
ELECTROCHEMICAL ELECTRODES;
ELECTRODES;
ELECTROMAGNETIC FIELD THEORY;
ELECTROMAGNETIC FIELDS;
GOLD;
METALLIZING;
METALLOGRAPHIC MICROSTRUCTURE;
MICROSTRUCTURE;
OPTICAL DESIGN;
PHOTORESISTS;
SCREENING;
3-D STRUCTURES;
3D MICRO STRUCTURES;
3D MICROSTRUCTURE;
BOTTOM ELECTRODES;
COMSOL MULTIPHYSICS;
DEP FORCES;
DIELECTROPHORETIC;
DIELECTROPHORETIC CHIP;
DIELECTROPHORETIC FORCES;
ELECTRICAL CONDUCTIVITY;
ELECTRICAL VOLTAGE;
FABRICATION PROCESSES;
INTERNATIONAL CONFERENCES;
MICRO-BEAD;
MOLECULAR SYSTEMS;
MULTIPLE ELECTRODES;
NON-UNIFORM ELECTRIC FIELDS;
OPTIMUM FREQUENCY;
PARTICLE SORTING;
PHASE ANGLES;
PLANAR ELECTRODES;
THEORETICAL ANALYSIS;
DIELECTRIC DEVICES;
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EID: 50249140198
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/NEMS.2008.4484457 Document Type: Conference Paper |
Times cited : (4)
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References (5)
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