Economic analysis of 450mm wafer migration

IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Volumn , Issue , 2007, Pages 283-286

  Chien, Chen Fu ^a   Wang, J K ^a   Chang, Tzu Ching ^a   Wu, Wen Chin ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

450mm; Fab economics; Manufacturing strategy

Indexed keywords

COST REDUCTION; COSTS; ELECTRIC CONDUCTIVITY; FINANCE; INDUSTRIAL ECONOMICS; INTEGRATED CIRCUITS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR GROWTH; SEMICONDUCTOR MATERIALS;

450MM; CHIPMAKERS; EQUIPMENT VENDORS; FAB ECONOMICS; GROWTH AND PROFITABILITY; INTERNATIONAL SYMPOSIUM; LITTLE RESEARCH; MANUFACTURING STRATEGY; MOORE'S LAWS; SEMICONDUCTOR INDUSTRIES; SEMICONDUCTOR MANUFACTURING; TECHNOLOGY ADVANCES; WAFER SIZES;

ECONOMIC ANALYSIS;

EID: 50249108393     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.2007.4446818     Document Type: Conference Paper

References (5)

1. R.C. Leachman, S. Ding, and C.-F. Chien, "Economic Efficiency Analysis of Wafer Fabrication," IEEE Trans on Automation Science and Engi., pp. 1-12, 2007.
2. J.S. Pettinato and D. Pillai (2005), "Technology Decisions to Minimize 450-mm Wafer Size Transition Risk," IEEE Transactions on Semiconductor Manufacturing, 18(4), 501-509.
3. G. Dan Hutcheson (2006), "450mm: What will it cost to get there", Future Fab International Magazine.
4. C.-F. Chien, C. Hsu, H. Chou and C. Lin, "Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity," Proceedings of International Symposium of Semiconductor Manufacturing, pp. 317-320, 2006.
5. ISMI, Industry Economic Model v10.1.