On the thermal stability margins of high-leakage current packaged devices

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 487-491

  Lee, Chang Chi ^a   De Groot, Johannes ^b  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b Zoran Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; FIXED-POINT ITERATIONS; GRAPHICAL APPROACH; PACKAGED DEVICES; PACKAGING TECHNOLOGIES; POWER DISSIPATIONS; TEMPERATURE-DEPENDENT; THERMAL PROPERTIES; THERMAL RUNAWAY; THERMAL STABILITY; TRANSIENT SIMULATIONS;

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; SYSTEM STABILITY; TECHNOLOGY; THERMODYNAMIC PROPERTIES; THERMODYNAMIC STABILITY;

LEAKAGE CURRENTS;

EID: 50249105337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342762     Document Type: Conference Paper

References (8)

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