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Volumn , Issue , 2006, Pages
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3D on-chip networking technology based on post-silicon devices for future networks-on-chip
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Author keywords
3D circuit; Carbon nanotube; Interconnect delay; Nano mechanical electrical system; Nanowire; NEMS; Post silicon
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Indexed keywords
CARBON NANOTUBES;
ELECTRIC NETWORK TOPOLOGY;
ELECTRIC WIRE;
FIELD EFFECT TRANSISTORS;
MESFET DEVICES;
NONMETALS;
SILICON;
THREE DIMENSIONAL;
3-D ARCHITECTURE;
3D CIRCUIT;
CARBON NANOTUBE;
FUTURE NETWORKS;
HIGH-BANDWIDTH;
INTERCONNECT DELAY;
INTERNATIONAL CONFERENCES;
LOW-LATENCY;
NANO WIRES;
NANO-MECHANICAL ELECTRICAL SYSTEM;
NANO-NET;
NANO-NETWORKS;
NANOWIRE;
NEMS;
NETWORKING TECHNOLOGIES;
ON CHIPS;
POST-SILICON;
SILICON DEVICES;
THREE-DIMENSIONAL ARCHITECTURES;
TELECOMMUNICATION NETWORKS;
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EID: 50149115653
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/NANONET.2006.346233 Document Type: Conference Paper |
Times cited : (9)
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References (8)
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