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Volumn , Issue , 2007, Pages 595-599

Ultra compact LTCC based AiP for 60 GHz applications

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ACCESSORIES; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; POWDERS; SOLUTIONS; STANDARDS; TECHNOLOGY;

EID: 50049126127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469762     Document Type: Conference Paper
Times cited : (4)

References (8)
  • 2
    • 0036103006 scopus 로고    scopus 로고
    • Wireless 1.25 Gb/s Transceiver Module at 60 GHz-Band
    • Ohata, K., et al., " Wireless 1.25 Gb/s Transceiver Module at 60 GHz-Band", ISSCC Digest, Vol.2, 2002
    • (2002) ISSCC Digest , vol.2
    • Ohata, K.1
  • 3
    • 0036066854 scopus 로고    scopus 로고
    • A 60 GHz MMIC Chipset for 1-Gbit/s Wireless Links
    • Fujii, K, et al., A 60 GHz MMIC Chipset for 1-Gbit/s Wireless Links", IEEE-MTT-S International, Vol. 3, 2002, pp: 1725.
    • (2002) IEEE-MTT-S International , vol.3 , pp. 1725
    • Fujii, K.1
  • 4
    • 0035716971 scopus 로고    scopus 로고
    • Integrated antennas on Si, proton-implanted Si and Si-on-Quartz
    • January
    • K. T. Chan, A. Chin, Y. P. Chen, Y. D. Lin, T. S. Duh, W. J. Lin, "Integrated antennas on Si, proton-implanted Si and Si-on-Quartz," IEDM Tech. Dig., pp. 903-906, January 2001.
    • (2001) IEDM Tech. Dig , pp. 903-906
    • Chan, K.T.1    Chin, A.2    Chen, Y.P.3    Lin, Y.D.4    Duh, T.S.5    Lin, W.J.6
  • 5
    • 0043093693 scopus 로고    scopus 로고
    • A 60 GHz Integrated Antenna Array for Hig-Speed Digital Beamforming Applications on Si, proton-implanted Si and Si-on-Quartz
    • J. Y. Park, Y. Wang, T. Itoh, "A 60 GHz Integrated Antenna Array for Hig-Speed Digital Beamforming Applications on Si, proton-implanted Si and Si-on-Quartz," IEEE MTT-s Int. Sypm., Vol. 3, 2003, pp : 1677 - 1680.
    • (2003) IEEE MTT-s Int. Sypm , vol.3 , pp. 1677-1680
    • Park, J.Y.1    Wang, Y.2    Itoh, T.3
  • 6
    • 33847305995 scopus 로고    scopus 로고
    • Maruhashi. K, at al., 60-GHz-Band LTCC Module Technology for Wireless Gigabit Transceiver Applications, RFIT2005, 2005.
    • Maruhashi. K, at al., 60-GHz-Band LTCC Module Technology for Wireless Gigabit Transceiver Applications", RFIT2005, 2005.
  • 7
    • 33747302313 scopus 로고    scopus 로고
    • A chip-scale packaging technology for 60-GHz wireless chipsets, Microwave Theory and Techniques
    • Pfeiffer, U.R.; Grzyb, J.; Duixian Liu; Gaucher, B.; Beukema, T.; Floyd, B.A.; Reynolds, S.K., "A chip-scale packaging technology for 60-GHz wireless chipsets", Microwave Theory and Techniques, IEEE MTT Transactions, Vol. 54, No. 8, 2006, pp:3387 - 3397.
    • (2006) IEEE MTT Transactions , vol.54 , Issue.8 , pp. 3387-3397
    • Pfeiffer, U.R.1    Grzyb, J.2    Liu, D.3    Gaucher, B.4    Beukema, T.5    Floyd, B.A.6    Reynolds, S.K.7
  • 8
    • 33745598931 scopus 로고    scopus 로고
    • Monolithic LTCC SiP for Transmitter for 60 GHz Wireless Communication Terminals
    • Y.C. Lee, W. Chang, and C.S. Park, "Monolithic LTCC SiP for Transmitter for 60 GHz Wireless Communication Terminals", IEEE MTT-S. IMS Digest, 2005.
    • (2005) IEEE MTT-S. IMS Digest
    • Lee, Y.C.1    Chang, W.2    Park, C.S.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.