Investigation of a Sic module with a high operating temperature for power applications

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 931-936

  Tokuda, H ^a   Tanaka, Y ^b   Nakagawa, H ^b   Aoyagi, M ^b   Fukuda, K ^b   Ohashi, H ^b   Tsuno, T ^a   Hoshino, T ^a   Namikawa, Y ^a   Hayashi, H ^a  

^a SUMITOMO ELECTRIC INDUSTRIES LTD   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AREA RATIOS; AU-SN SOLDER; CERAMIC SUBSTRATES; DC CURRENTS; DEVICE TEMPERATURE; DIRECT BONDS; HEAT SINKING; HIGH OPERATING TEMPERATURE; HIGH TEMPERATURE; HIGH-TEMPERATURE AGEING; LEAD-FREE; LEAD-FREE SOLDER; MULTI-LAYERED STRUCTURES; PACKAGING TECHNOLOGIES; POWER APPLICATIONS; REFLOW CONDITIONS; REFLOW PROCESS; SILICON CARBIDE (SIC); SIMULATION RESULTS; SN-AG-CU; SN-AG-CU SOLDER;

BRAZING; CHIP SCALE PACKAGES; COPPER; COPPER ALLOYS; CRACKS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; GLASS INDUSTRY; HEAT SINKS; LEAD; NONMETALS; OPTICAL DESIGN; PLATES (STRUCTURAL COMPONENTS); SILICON; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; SULFATE MINERALS; TECHNOLOGY; TEMPERATURE DISTRIBUTION; TESTING; THERMOANALYSIS; THERMOSTATS; TIN ALLOYS; WELDING;

TIN;

EID: 50049122411     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469788     Document Type: Conference Paper

References (7)

1. Stan.Actitty, " High voltage, high temperature power electronic utility applications", 2005 Electronics Packaging Technology Conference (HiTEC 2006).
2. H. Daimon, M. Yamanaka, M. Shinohara, E. Sakuma, S. Misawa, K. Endo, S. Yoshida, "Operation of Schottky-barrier Field-effect Transistors of 3C-SiC up to 400°C", Applied Physics Letters, Volume 51, Issue 25, December 21, 1987, pp. 2106-2108.
3. L. Chen, D. Spry, P. Neudeck, "Demonstration of 500°C AC Amplifier Based on SiC MESFET and Ceramic Packaging ", 2005 Electronics Packaging Technology Conference (HiTEC 2006).
4. F. Lang, Y. Hayashi, H. Nakagawa, M. Aoyagi, H. Ohashi, "A Novel Chip Joint Method for High Temperature Operated SiC Power Modules", Proceedings of EPTC 2006.
5. th Symposium on Microjointing and Assembly Technology in Electronics (mate 2005).
6. Laxmidhar Biswal, Arvind Krishna, Doug Sprunger, "Effect of Solder Voids on Thermal Performance of a High Power Electronic Module", Proceedings of EPTC 2005.
7. Chan, C.F, "An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder", Proceedings of EPTC 2000.