Integration of glass layer for meso and micro-system applications

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 206-210

  Tan, Y M ^a   Khoong, L E ^a   Lam, Y C ^b   Lu, C W ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; BUILDING MATERIALS; CERAMIC MATERIALS; CHIP SCALE PACKAGES; COBALT; COBALT COMPOUNDS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; GLASS; GLASS CERAMICS; INTEGRATION; NONMETALS; OPTICAL DESIGN; OPTICAL SYSTEMS; RELIABILITY; SHEAR STRENGTH; SILICON; SUBSTRATES; TECHNOLOGY;

BONDING INTERFACES; BONDING PROCESSES; COMPOSITE SUBSTRATES; COMPOSITE TECHNOLOGY; EDGE DEFORMATION; FABRICATION PROCESSES; GLASS CHIPS; HETEROGENEOUS STRUCTURES; INTERFACIAL AREA; INTERFACIAL INTEGRITY; INTRINSIC PROPERTIES; LOW-TEMPERATURE CO-FIRED CERAMIC; LTCC SUBSTRATES; MICRO-ELECTRONIC DEVICES; MICRO-SYSTEMS; MULTI-FUNCTIONAL; MULTILAYER TECHNOLOGY; OPEN CAVITIES; OPTICAL ACCESSES; PACKAGING TECHNOLOGIES; RECENT DEVELOPMENT; SCANNING ACOUSTIC MICROSCOPY; SILICON TECHNOLOGIES; STRENGTH TESTING; SYSTEM APPLICATIONS; VISIBLE-LIGHT;

GLASS BONDING;

EID: 50049121337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469736     Document Type: Conference Paper

References (5)

1. Bau, H., Ananthasuresh, S., Santiago-Aviles, J.J., Zhong, J., Kim, M., Yi, M., Espinoza-Vallejos, P., Sola-Laguna, L., Ceramic tape based meso systems technology, in: Proceedings of the ASME International Mechanical Engineering Congress and Exposition, Anaheim, CA, 1988, pp. 491-498.
2. Gongora-Rubio, M. R., Espinoza-Vallejos, P., Sola-Laguna, L., Santiago-Aviles, J. J., Overview of low temperature co-fired ceramics tape technology for mesosystem technology (MsST), Sensors and Actuators A, Vol. 89, 2001, pp. 222-241.
3. Peterson, K. A., Rohde, S. B., Walker, C. A., Patel, K. D., Turner, T. S., Nordquist, C. D., Microsystem integration with new techniques in LTCC, Proceedings of the Ceramic Interconnect Technology Conference, IMAPS, Denver, CO, 2004, pp. 19-26
4. Peterson, K. A., Patel, K. D., Ho, C. K., Rohde, S. B., Nordquist, C. D., Walker, C. A., Wroblewski, B. D., Okandan, M., Novel microsystem applications with new techniques in low-temperature co-fired ceramics, International Journal of Applied Ceramic Technology, Vol. 2, 2005, pp. 345-363.
5. Youngsman, J., Marx, B., Schimplf, M., Wolter, S., Glass, J., Moll, A., Low temperature co-fired ceramics for microfluidics, IEEE Electronic Components and Technology Conference, 2006, pp. 699-704.