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Volumn , Issue , 2007, Pages 799-804

Temperature distribution and short circuit events in IGBT-modules used in traction inverters

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC FAULT LOCATION; ELECTRONICS INDUSTRY; INDUSTRIAL ELECTRONICS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); TECHNICAL PRESENTATIONS; TEMPERATURE DISTRIBUTION; THERMOANALYSIS; THERMOSTATS; TRACTION (FRICTION); WELDS;

EID: 50049113615     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISIE.2007.4374699     Document Type: Conference Paper
Times cited : (7)

References (10)
  • 3
    • 0031633633 scopus 로고    scopus 로고
    • R. Kraus, P. Türkes, J. Sigg, Physics-based Models of Power Semiconductor Devices for the Circuit Simulator Spice, PESC 98 Record, 1998.
    • R. Kraus, P. Türkes, J. Sigg, "Physics-based Models of Power Semiconductor Devices for the Circuit Simulator Spice", PESC 98 Record, 1998.
  • 4
    • 0032071510 scopus 로고    scopus 로고
    • Status and Trends of Power Semiconductor Devices Models for Circuit Simulation
    • May
    • R. Kraus, H. J. Mattausch, "Status and Trends of Power Semiconductor Devices Models for Circuit Simulation", IEEE Transactions on Power Electronics, Vol. 13, No. 3, May 1998.
    • (1998) IEEE Transactions on Power Electronics , vol.13 , Issue.3
    • Kraus, R.1    Mattausch, H.J.2
  • 6
    • 0035333734 scopus 로고    scopus 로고
    • Physically based compact device models for circuit modeling applications
    • P. A. Mawby, P. M. Igic, M. S. Towers, "Physically based compact device models for circuit modeling applications", Microelectronics Journal, vol. 32, pp. 433-447, 2002.
    • (2002) Microelectronics Journal , vol.32 , pp. 433-447
    • Mawby, P.A.1    Igic, P.M.2    Towers, M.S.3
  • 8
    • 33748040759 scopus 로고    scopus 로고
    • New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions
    • September
    • D. Barlini, M. Ciappa, A. Castellazzi, M. Mermet-Guyennet, W. Fichtner, "New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions", Microelectronics Reliability, vol. 46, pp. 1772-1777, September 2006.
    • (2006) Microelectronics Reliability , vol.46 , pp. 1772-1777
    • Barlini, D.1    Ciappa, M.2    Castellazzi, A.3    Mermet-Guyennet, M.4    Fichtner, W.5
  • 9
    • 50049083442 scopus 로고    scopus 로고
    • Maxwell 3D, User Manual.
    • Maxwell 3D, User Manual.
  • 10
    • 50049116523 scopus 로고    scopus 로고
    • Méthodologie et outils de calcul numérique pour la prise en compte de la compatibilité électromagnétique des nouveaux prototypes des circuit intégrés de puissance
    • PhD-Thesis, University of Toulouse III
    • G. Lourdel, "Méthodologie et outils de calcul numérique pour la prise en compte de la compatibilité électromagnétique des nouveaux prototypes des circuit intégrés de puissance", PhD-Thesis, University of Toulouse III, 2005.
    • (2005)
    • Lourdel, G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.