Package development for MEMS based 3D micro-mirror optical bio-probe for OCT application

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 347-351

  Kelvin, Chen Wei Sheng ^a   Premachandran, C S ^a   Ratmin, Ahmad Khairyanto Bin ^a   Singh, Janak ^a   Yoon, Seung Wook ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; OPTICAL FIBERS; PHOTORESISTS; PROBES; SOLDERING;

FLEX CIRCUITS; MECHANICAL DICING; MEMSDEVICES; MICRO MIRROR; PACKAGE DEVELOPMENT; SOLDER BALLS; THICK PHOTORESISTS; WIREBONDING;

LENSES;

EID: 50049113016     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469813     Document Type: Conference Paper

References (4)

1. Dennis V. Pham, M.D David, "The Use of Optical Coherence Tomography to Image Neurovascular Structures", University of Southern California (2005)
2. th Electronic Components and Technology Conference. (2007)
3. Yingshun Xu, "MEMS Based Non-rotatory Circumferential Scanning Optical Probe for Endoscopic Optical Coherence Tomography," Proceedings of SPIE-OSA Biomedical Optics, Vol. 6627 (SPIE, Bellingham, WA, 2007) 662715.
4. Chin C. Lee., "Fundamentals of Fluxless Soldering Technology," IEEE Advanced Packing Materials Symposium. (2005)