Fabrication and characterization of silicon-polymer beam structures for cantilever-type tactile sensors

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 1461-1464

  Sohgawa, M ^a   Huang, Y M ^a   Yamashita, K ^a   Kanashima, T ^a   Noda, M ^a,b   Okuyama, M ^a   Noma, H ^c  

^a OSAKA UNIVERSITY   (Japan)

^b KYOTO INSTITUTE OF TECHNOLOGY   (Japan)

^c ADVANCED TELECOMMUNICATIONS RESEARCH INSTITUTE INTERNATIONAL   (Japan)

Author keywords

Cantilever; Elastomer; Strain gauge; Surface micromachining; Tactile sensor

Indexed keywords

ACTUATORS; DETECTORS; GAGES; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; OPTICAL SENSORS; PHOTORESISTS; PLASTICS; PLATINUM; POLYMERS; RUBBER; SILICON; TRANSDUCERS;

BEAM STRUCTURES; CANTILEVER; CURING TEMPERATURES; DEPOSITION CONDITIONS; ELASTOMER; FLUORO POLYMERS; INTERNATIONAL CONFERENCES; OPTIMAL THICKNESS; POLYMER LAYERS; PROCESS YIELD; SOLID-STATE SENSORS; STRAIN GAUGE; SURFACE MICROMACHINING; TACTILE SENSOR; TACTILE SENSORS; TEMPERATURE DRIFTS;

SENSORS;

EID: 50049096421     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300420     Document Type: Conference Paper

References (4)

1. S. Yoshida, T. Mizota and H. Noma, "Development of an Integrated Multi-Axis Tactile Sensor: Distributed Preprocessing for Tactile Recognitions", IEEE-Virtual Reality, USA, Mar., 2007.
2. M. Sohgawa, M. Noda, Y. -M. Huang, K. Yamashita, T Kanashima, M. Okuyama and H. Noma, "Studies on Deflection Control of Bilayer Cantilever Fabricated by Surface Micromachining Process on SOI Wafer", Proc. of 23rd Sensor Symposium, 165-169, 2006.
3. Y. -M. Huang, M. Sohgawa, M. Noda, K. Yamashita, M. Okuyama and H. Noma, "Studies on Curvature Deformation Control of Bilayer Cantilever Fabricated by Surface Micromachining of SOI Wafer", to be published in MRS proceedings, Vol. 969.
4. K. Noda, K. Hoshino, K. Matsumoto and I. Shimoyama, "300nm-thick cantilever in PDMS for tactile sensing", IEEE Micro Electro Mechanical Systems, USA, Jan.30-Feb. 2, pp. 283-286, 2005,.