Improved neuronal adhesion to the surface of electronic device by engulfment of protruding micro-nails fabricated on the chip surface

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 1247-1250

  Spira, Micha E ^a   Kamber, Dotan ^a   Dormann, Ada ^a   Cohen, Ariel ^a   Bartic, Carmen ^b   Borghs, Gustaf ^b   Langedijk, J P M ^c   Yitzchaik, Shlomo ^a   Shabthai, Keren ^a   Shappir, Josef ^a  

^a HEBREW UNIVERSITY OF JERUSALEM   (Israel)

^b IMEC   (Belgium)

^c Pepscan NV   (Netherlands)

Author keywords

Adhesion to substrate; Cultured neurons; Neuro electronic hybrids; Seal resistance

Indexed keywords

ACTUATORS; AMINES; ANTIGEN-ANTIBODY REACTIONS; CELL MEMBRANES; GOLD; MICROSYSTEMS; MILITARY OPERATIONS; OPTICAL DESIGN; SENSORS; SIGNAL TO NOISE RATIO; TRANSDUCERS;

ADHESION TO SUBSTRATE; CHIP SURFACES; CULTURED NEURONS; ELECTRICAL COUPLING; ELECTRICAL RESISTANCES; ELECTRONIC DEVICES; ENGULFMENT; EXTRACELLULAR; FUNCTIONALIZED; INTERNATIONAL CONFERENCES; LOW-RESISTANCE; NEURO-ELECTRONIC HYBRIDS; PHYSICAL CONTACTS; PLASMA MEMBRANE; SEAL RESISTANCE; SOLID-STATE SENSORS;

SURFACE CHEMISTRY;

EID: 50049093971     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300363     Document Type: Conference Paper

References (6)

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