Why you will use the deep X-ray LIG(A) technology to produce MEMS?

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1491-1497

  Meyer, Pascal ^a   Schulz, Joachim ^b   Hahn, Lothar ^b   Saile, Volker ^a,b  

^a UNIVERSITY OF KARLSRUHE   (Germany)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROFORMING; FORMING; ONTOLOGY; OPTICAL DESIGN; OSCILLATORS (ELECTRONIC); TECHNOLOGY;

ABFORMUNG; DIFFERENT PROCESSES; DIMENSIONAL TOLERANCES; LEADING EDGES; LIGA PROCESS; LIGA TECHNIQUES; LITHOGRAPHIE; MASS FABRICATION; MICRO-MANUFACTURING; QUALITY PROBLEMS; QUALITY PROPERTIES; RESEARCH CENTERS; SURFACE QUALITIES; UNIQUE FEATURES; X-RAY LITHOGRAPHY;

LITHOGRAPHY;

EID: 49949107571     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0503-1     Document Type: Conference Paper

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