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Volumn , Issue , 2008, Pages
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Materials and processing issues for the manufacturing of integrated passive and active devices on flexible substrates
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVE DEVICES;
ACTIVE REGIONS;
BUILDING BLOCKS;
DEPOSITED THIN FILMS;
FLEXIBLE ELECTRONICS;
FLEXIBLE SUBSTRATES;
FUNDAMENTAL PROPERTIES;
HIGH-DENSITY;
IN-VACUUM;
INORGANIC FILMS;
LASER PROCESSING;
MICROSTRUCTURAL PROPERTIES;
OPTICAL PATTERNING;
PASSIVE DEVICES;
PLASTIC FOILS;
PLASTIC SUBSTRATES;
POLY-SI;
PRECISION RESISTORS;
PROCESSING CONDITIONS;
SMART SYSTEMS;
TECHNOLOGICAL PLATFORMS;
THIN FILMS DEPOSITION;
VERY LOW TEMPERATURE;
CAPACITANCE;
CAPACITORS;
DIELECTRIC DEVICES;
DIELECTRIC PROPERTIES;
ELECTRIC EQUIPMENT;
ENERGY STORAGE;
EXHIBITIONS;
MATERIALS PROPERTIES;
RESISTORS;
SILICON;
THICK FILMS;
THIN FILM DEVICES;
THIN FILMS;
TRANSISTORS;
VACUUM DEPOSITION;
PLASTICS;
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EID: 49749135777
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/FEDC.2008.4483874 Document Type: Conference Paper |
Times cited : (1)
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References (1)
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