Size and temperature dependence of Young's modulus of a silicon nano-plate

Journal of Physics D: Applied Physics

Volumn 41, Issue 16, 2008, Pages

  Wang, Jing ^a   Huang, Qing An ^a   Yu, Hong ^a  

^a Southeast University   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOND LENGTH; CONTINUUM MECHANICS; ELASTIC MODULI; ELASTICITY; SILICON; TEMPERATURE DISTRIBUTION;

BULK COUNTERPART; CONTINUUM MODELING; LATTICE PARAMETERS; MECHANICAL ANALYSIS; QUASI-HARMONIC APPROXIMATION; SIZE DEPENDENT; STRAIN-ENERGY; TEMPERATURE CO-EFFICIENT; TEMPERATURE DEPENDENCES; YOUNG'S MODULUS;

NONMETALS;

EID: 49749134724     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/41/16/165406     Document Type: Article

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