Surface relaxation effect on the distributions of energy and bulk stresses in the vicinity of Cu surface: An embedded-atom method study

Journal of Applied Physics

Volumn 104, Issue 3, 2008, Pages

  Sun, Z H ^a   Wang, X X ^a   Wu, H A ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC PHYSICS; ATOMS; COPPER; COPPER ALLOYS; CRYSTALLINE MATERIALS; CRYSTALLOGRAPHY; EVAPORATIVE COOLING SYSTEMS; IMAGE SEGMENTATION;

BULK STRESS; CU SURFACES; EMBEDDED-ATOM METHOD; ENERGY RELEASES; MOLECULAR STATICS SIMULATIONS; ORIENTATION DEPENDENCE; RELAXATION EFFECTS; SURFACE REGIONS;

SURFACE RELAXATION;

EID: 49749128844     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2958330     Document Type: Article

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