Low keV FIB applications for circuit edit

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2007, Pages 312-318

  Rue, Chad ^a   Shepherd, Randall ^b   Hallstein, Roy ^b   Livengood, Rick ^b  

^a Thermo Fisher Scientific   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 49649118317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. M. Abramo, et al, "Gas Assisted Etching: An Advanced Technique for FIB Device Modification," Proc. 20th ISTFA, Los Angeles, CA, Nov. 1994, pp. 439-446
2. C. Rue et al, "Mixed Field Deprocessing," Presented at the Meeting of the European FIB User's Group (EFUG), Wuppertal, Germany, Oct. 2006.
3. C. Rue, "Skeletal Etch," Presented at the ISTFA FIB User's Group Meeting, Austin, TX, Nov. 2006.
4. 2O Enhanced Focused Ion Beam Micromachining," J. Vac. Sci. Technol. B13, 2565 (1995).
5. C. Chandler, FEI Company, "private communication."
6. M. Utlaut, M. Maazouz, J. Orloff, FEI Company, "private communication."
7. J. F. Zeigler et al, "The Stopping and Range of Ions in Matter," Software Version SRIM-2006.02. Free download available at srim.org.