The influence of stamp deformation on residual layer homogeneity in thermal nanoimprint lithography

Microelectronic Engineering

Volumn 85, Issue 9, 2008, Pages 1892-1896

  Merino, S ^a   Retolaza, A ^a   Juarros, A ^a   Schift, H ^b  

^a IK4 TEKNIKER   (Spain)

^b PAUL SCHERRER INSTITUTE   (Switzerland)

Author keywords

Bending; Nanoimprint lithography; Stamp thickness

Indexed keywords

NICKEL; NONMETALS; SILICON;

BENDING; FILL FACTOR; NANO IMPRINTS; PATTERN TRANSFERRING; RESIDUAL LAYER THICKNESS; RESIDUAL LAYERS; STAMP THICKNESS;

NANOIMPRINT LITHOGRAPHY;

LITHOGRAPHY; NICKEL; OPTIMIZATION; PARAMETERS; THERMAL ANALYSIS; THICKNESS;

EID: 49549105994     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.06.011     Document Type: Article

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