Benzocyclobutene-based polymers for microelectronic applications

ACS Symposium Series

Volumn 874, Issue , 2004, Pages 279-293

  So, Ying Hung ^a   Garrou, Phil E ^a   Im, Jang Hi ^a   Ohba, Karou ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 49549098184     PISSN: 00976156     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (24)

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3. Garrou, P. Chapter 9 Thin Film Packaging and Interconnect. In Thin Film Technology Handbook, Elshabini-Riad, A., Barlow, F. Eds., McGraw Hill: New York, 1997.
4. Garrou, P. Polymer Dielectrics for Multichip Module Packaging. Proceedings of IEEE, Vol. 80, 1992, 1942-1954.
5. ndEd., Tummala, R. R., Rymaszewski, E. J., Klopfenstein, A. G., Eds.; Chapman & Hall: New York, 1997, 509-623.
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14. nd ACS National Meeting, Chicago, IL, August 26-30, 2001.
15. The CAS name for the BCB hydrocarbon is bicyclo[4.2.0]octa-1,3,5-triene, and it is also known as 1,2-dihydrobenzocyclobutene and benzocyclobutene.
16. For references of the synthetic steps, see So, Y. H.; Garrou, P. E.; Im, J. H.; Scheck, D. M. Chemical Innovation, 2001, 31, 40-47.
17. Stokich, T. M.; Lee, W. M.; Peters, R. A. Real Time FT-IR Studies of the Reaction Kinetics for the Polymerization of Divinylsiloxane bis-Benzocyclotutene Monomers, Mat. Res. Soc. Symp. Proc. 1991, 227, 103-114.
18. Im, J.; Shaffer II, E. O.; Peters, R.; Rey, T.; Murlick, C.; Sammler, R. L. Physical and Mechanical Properties Determination of Photo-BCB-Based Thin Films. Proc. Int. Soc. Hybrid Microelectronics, Minneapolis, MN, 1996, 168-175.
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20. Toughened Plastics II-Novel Approaches in Science and Engineering. Riew, C. K., Kinloch, A. J., Eds.; ACS Advances in Chemistry Series 252; American Chemical Society: Washington, DC, 1996.
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22. Ohba, K.; Akimoto, H.; Kohno, M.; So, Y. H.; Im, J. H.; Garrou, P. E.; Shimoto, T.; Matsui, K.; Shimada, Y. Development of CYCLOTENE Polymer Coated Cu Foil for Build-up Board Application. 2000 IEMT/IMC Symposium, Tokyo, Japan, April 19-21, 2000, 41-46.
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