Graphitic foam with high strength and high thermal conductivity doped by tungsten

Cellular Polymers

Volumn 27, Issue 4, 2008, Pages 251-260

  Wang, Yong ^a   Cao, Lingling ^a   Gao, Jin ^a   Wang, Yimin ^a  

^a DONGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRENGTH; SCANNING ELECTRON MICROSCOPY; TUNGSTEN;

CELL WALLS; GRAPHITIC FOAM; HIGH STRENGTH; HIGH THERMAL CONDUCTIVITY; MESOPHASE PITCH; PRECURSOR MATERIALS; TUNGSTEN CONCENTRATIONS; UNIFORM PORE;

THERMAL CONDUCTIVITY;

EID: 49549087261     PISSN: 02624893     EISSN: None     Source Type: Journal    
DOI: 10.1177/026248930802700403     Document Type: Article

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