Effects of Ti incorporation in Ni on silicidation reaction and structural/electrical properties of NiSi

Journal of the Electrochemical Society

Volumn 151, Issue 9, 2004, Pages

  Lee, R T P ^a   Chi, D Z ^a   Lai, M Y ^a   Yakovlev, N L ^a   Chua, S J ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL PROPERTIES; FILM AGGLOMERATION; INTERFACIAL REACTIONS; PHASE STABILITY;

GRAIN BOUNDARIES; LEAKAGE CURRENTS; RAPID THERMAL ANNEALING; SECONDARY ION MASS SPECTROMETRY; SILICON; THERMODYNAMIC STABILITY; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

THIN FILMS;

EID: 4944244328     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1782634     Document Type: Article

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