Electrochemical deposition of Cu under superimposition of high magnetic fields

Journal of the Electrochemical Society

Volumn 151, Issue 9, 2004, Pages

  Uhlemann, M ^a   Schlorb H ^b   Msellak, K ^b   Chopart, J P ^b  

^a IFW DRESDEN   (Germany)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; ELECTRODES; ELECTROLYTES; KINEMATICS; MAGNETIC FIELDS; MAGNETIC PERMEABILITY; MAGNETOHYDRODYNAMICS; THICKNESS MEASUREMENT; VISCOSITY;

DIFFUSION LAYERS; LORENTZ FORCE; MICROVORTEXES; SUPERIMPOSITION;

ELECTRODEPOSITION;

EID: 4944235233     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1782991     Document Type: Article

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