System design of a 3D integrated non-isolated point of load converter

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2008, Pages 181-186

  Ball, Arthur ^a   Lim, Michele ^a   Gilham, David ^a   Lee, Fred C ^a  

^a State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; COBALT COMPOUNDS; COOLING; COPPER; EXHIBITIONS; HEAT SINKS; HEAT STORAGE; THREE DIMENSIONAL;

EXTERNAL-; HIGH POWER DENSITY; HIGH POWERS; HIGH RATES; ISOLATED POINT; LIGHT-LOAD EFFICIENCY; LOW-TEMPERATURE CO-FIRED CERAMIC; MULTI LAYERING; OUTPUT CURRENTS; POL CONVERTERS; SYSTEM DESIGNS; THERMAL MANAGEMENT;

POWER ELECTRONICS;

EID: 49249118880     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2008.4522719     Document Type: Conference Paper

References (14)

1. K. Exel and J. Schulz-Harder, Water Cooled DBC Direct Bonded Copper Substrates. Eschenbach, Germany: Curamik Electronics GmbH, 2005.
2. J. Schulz-Harder, Direct Bonded Copper Substrates for Semiconductor Power Devices. Eschenbach, Germany: Curamik Electronics GmbH, 2005.
3. Mariya Ivanova, Yvan Avenas, Christian Schacffer, Jean-Bemard Dezord, and Juergen Schulz-Harder, Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging, IEEE Transactions on Power Electronics, Vol. 21, No. 6, November 2006, pp. 1541-1546
4. Schulz-Harder J., Dezord J., Schaeffer, Avenas, Puig O., Rogg. A., DBC (Directed Bonded Copper) substrate with integrated flat heat pipe, EMPC 2005, June 12-15, Brugge, Belgium
5. P. Cadre, A. Petitbon, N. Changey, E. Ranchiy, New Encapsulation Technique Using Standard DBC Substrate Technology, Alcatel Alsthom Recherche, IEEE 1998, pp. 2103-2107
6. Dr. Jurgen Schulz-Harder, DBC Substrates as a Base for Power MCMs, 2000 Electronics Packaging Technology Conference, 2000, pp. 315-320
7. James M. Fusaro, Guillermo L. Romero, Pablo Rodriguez and Joe L. Martinez, Jr., Thermal Characterization of DBC and MMC Stacks for Power Modules, IEEE 1996, pp. 1411-1417
8. M. H. F. Lim, J. D. van Wyk and Z. Liang, "Impact of Conductor Crosssectional Shape on Component Losses and System Performance", Ceramics Interconnect and Ceramics Microsystems Conf., 25-27April 2006, session WA3.
9. M. H. F. Lim, J. D. van Wyk and Z. Liang, "Effect of geometry variation of LTCC distributed air-gap filter inductor on light load efficiency of DC-DC converters", Ind. Appl. Soc. Conf., IAS, Tampa, Florida, 8-12 Oct 2006.
10. M. H. F. Lim, J. D. van Wyk and Z. Liang, "LTCC Technology, an Integration Solution for Power Electronics", Ceramics Interconnect and Ceramics Microsystems Conf., 25-27April 2006, session WP3.
11. M. H. Lim, Z. Liang, J. D. van Wyk, "An improved low profile integratable LTCC power inductor for microprocessor power delivery applications", 4th Int'l Conf. on Integrated Power Electronics Systems, 7-9 June 2006, Naples, Italy, pp. 299-304.
12. M. H. F. Lim, Z. Liang, and J. D. van Wyk, "Low Profile Integratable Inductor Fabricated Based On LTCC Technology For Microprocessor Power Delivery Applications", to be published in IEEE Trans. on Comp. and Packaging Tech.
13. M. H. F. Lim, J. D. van Wyk, K. D. T. Ngo, "Shielded LTCC Inductor as Substrate for Power Converter", submitted to Pow. Electronics Specialists Conf., PESC 2007, 17-21 June 2007.
14. M. H. F. Lim, J. D. van Wyk, K. D. T. Ngo "Modeling of an LTCC Inductor Capable of Improving Light-Load Efficiency", to be presented in APEC 2007.