Broadband active balun using combined cascode-cascade configuration

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 8, 2008, Pages 1790-1796

  Jung, Kooho ^b   Eisenstadt, William R ^a,c   Fox, Robert M ^a,c   Ogden, Alvin W ^c   Yoon, Jangsup ^d  

^a IEEE

^b Cascade Microtech Inc   (United States)

^c University of Florida   (United States)

^d SiRF Technology Inc   (United States)

Author keywords

Active balun; Broadband balun; Built in self test (BiST); CMOS balun; Combined cascode cascade balun (C3 balun)

Indexed keywords

BUILT-IN SELF TEST; CMOS INTEGRATED CIRCUITS; CURVE FITTING; NETWORKS (CIRCUITS); POWDERS;

ACTIVE BALUN; BI-CMOS PROCESS; BROAD BAND WIDTHS; BROADBAND BALUN; BUILT IN SELF TESTING; BUILT-IN SELF-TEST (BIST); CASCADE CONFIGURATION; CASCODE; CHIP AREAS; CMOS BALUN; COMBINED CASCODE-CASCADE BALUN (C3 BALUN); DC BLOCKING; DC POWER CONSUMPTIONS; DIFFERENTIAL CIRCUITS; DIFFERENTIAL OUTPUTS; DYNAMIC RANGE; IN PHASE;

TELECOMMUNICATION SYSTEMS;

EID: 49249113429     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2008.927306     Document Type: Article

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