Epoxy compositions and materials cured with complexes of imidazoles and Cu(II) cations;Kompozycje epoksydowe sieciowane kompleksami imidazoli z kationem Cu(II)

Polimery/Polymers

Volumn 53, Issue 7-8, 2008, Pages 526-530

  Pilawka, Ryszard ^a   Spychaj, Tadeusz ^a   Leistner, Aniela ^b  

^a WEST POMERANIAN UNIVERSITY OF TECHNOLOGY   (Poland)

^b Polymerics GmbH   (Germany)

Author keywords

Adhesive joints; Complex of imidazole with Cu(II); Epoxy resin; Latent hardener; Pot lifetime of a composition; Shear strength; Static mechanical properties

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; CURING; EPOXY RESINS; MAGNESIUM COMPOUNDS; MECHANICAL PROPERTIES; PLANTS (BOTANY); POSITIVE IONS; SHEAR STRENGTH;

COMPLEX OF IMIDAZOLE WITH CU; CURING AGENTS; CURING PROCESS; LATENT HARDENER; POT LIFETIME OF A COMPOSITION; STATIC MECHANICAL PROPERTIES; STRENGTH OF ADHESIVE JOINTS; THERMAL PARAMETERS;

COPPER COMPOUNDS;

EID: 49249099221     PISSN: 00322725     EISSN: None     Source Type: Journal    
DOI: 10.14314/polimery.2008.526     Document Type: Article

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