Treatment of copper from Cu CMP waste streams using polyethyleneimine

IEEE Transactions on Semiconductor Manufacturing

Volumn 21, Issue 3, 2008, Pages 481-485

  Maketon, Worawan Kay ^a   Ogden, Kimberly L ^b  

^a INTEL CORPORATION   (United States)

^b University of Arizona   (United States)

Author keywords

Chelators; Chemical mechanical planarization (CMP); Cu CMP waste treatment; Polyethyleneimine (PEI)

Indexed keywords

CHLORINE COMPOUNDS; COPPER ALLOYS; INDUSTRIAL WASTE TREATMENT; ION EXCHANGE; MICROFILTRATION; NANOTECHNOLOGY; PRECIPITATION (CHEMICAL); WASTE TREATMENT;

BREAK DOWN; CHELATORS; CHEMICAL-MECHANICAL PLANARIZATION (CMP); COPPER HYDROXIDES; CU CMP WASTE TREATMENT; POLYETHYLENE IMINE; POLYETHYLENEIMINE (PEI); PRE TREATMENTS; SLURRY PARTICLES; TREATMENT PROCESSES; WASTE STREAMS;

COPPER;

EID: 49249086168     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2008.2001226     Document Type: Conference Paper

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