Reducing costs and increasing throughput using model-based process control on sputtering systems

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 409-414

  Sattler, L ^a   Hecker, P E ^b   Raghavan, R ^b   Lin, H ^b  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; COPPER ALLOYS; DEPOSITION RATES; INDUSTRIAL ELECTRONICS; SILICON WAFERS;

CAPACITY INCREASE; CONSTANT THICKNESS; MODEL BASED PROCESS CONTROL; QUADRATIC MODELS; SOFTWARE CHANGE; SPUTTER PROCESS; SPUTTERING SYSTEMS; TEXAS INSTRUMENTS;

PROCESS CONTROL;

EID: 49149086253     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731166     Document Type: Conference Paper

References (6)

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