Probing thickness-dependent dislocation storage in freestanding Cu films using residual electrical resistivity

Applied Physics Letters

Volumn 93, Issue 4, 2008, Pages

  Chauhan, Shakti ^a   Bastawros, Ashraf F ^a  

^a Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; COPPER PLATING; CRYSTAL GROWTH; ELECTRIC RESISTANCE; ELECTROPLATING; GRAIN (AGRICULTURAL PRODUCT); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; METALLIC FILMS; MOLECULAR BEAM EPITAXY; STRENGTHENING (METAL);

AVERAGE GRAIN SIZES; CU FILMS; DEFORMATION MECHANISMS; DISLOCATION ANNIHILATION; ELECTROPLATED CU FILMS; FILM-THICKNESS; FREE SURFACES; GRAIN SIZES; GRAIN-SIZE EFFECTS; MICRO-STRUCTURAL; RESIDUAL ELECTRICAL RESISTIVITY; TENSILE LOADINGS; THICKNESS EFFECTS;

COPPER;

EID: 49149083834     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2961006     Document Type: Article

References (17)

1. Y. Xiang and J. Vlassak, Acta Mater. 54, 5449 (2006).
2. D. Y. W. Yu and F. Spaepen, J. Appl. Phys. 95, 2991 (2004).
3. H. D. Espinosa, B. C. Prorok, and B. Peng, J. Mech. Phys. Solids 52, 667 (2004).
4. M. A. Haque and M. T. A. Saif, Acta Mater. 51, 3053 (2003).
5. R. M. Keller, S. P. Baker, and E. Arzt, J. Mater. Res. 13, 1307 (1998).
6. H. J. Lee, P. Zhang, and J. C. Bravman, Appl. Phys. Lett. 84, 915 (2004).
7. H. J. Lee, P. Zhang, and J. C. Bravman, J. Appl. Phys. 93, 1443 (2003).
8. H. D. Espinosa, M. Panico, S. Berbenni, and K. W. Schwarz, Int. J. Plast. 22, 2091 (2006).
9. V. Yamakov, D. Wolf, S. R. Phillpot, A. K. Mukherjee, and H. Gleiter, Nat. Mater. 1, 45 (2002).
10. J. S. Stolken and A. G. Evans, Acta Mater. 46, 5109 (1998).
11. P. J. M. Janssen, Th. H. deKeijser, and M. G. D. Geers, Mater. Sci. Eng., A 419, 238 (2006).
12. S. Miyazki, K. Shibata, and H. Fujita, Acta Metall. 27, 855 (1979).
13. K. M. Mannan and K. R. Karim, J. Phys. F: Met. Phys. 5, 1687 (1975).
14. J. W. Lim and M. Isshiki, J. Appl. Phys. 99, 094909 (2006).
15. T. Ungar, E. Schafler, P. Hanak, S. Bernstorff, and M. Zehetbauer, Mater. Sci. Eng., A 462, 398 (2007).
16. S. Cheng, J. A. Spencer, and W. W. Milligan, Acta Mater. 51, 4505 (2003).
17. R. R. Keller, J. M. Phelps, and D. T. Read, Mater. Sci. Eng., A 214, 42 (1996).