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Volumn 33, Issue 14, 2008, Pages 3976-3990

Thermal stress analysis of the planar SOFC bonded compliant seal design

Author keywords

Bonded compliant seal; Finite element analysis; Planar solid oxide fuel cell; Thermal stress

Indexed keywords

(ABIOTIC AND BIOTIC) STRESS; (R ,S)-SYMMETRIC; COOLING CONDITIONS; DIFFERENTIAL THERMAL EXPANSION; FINITE ELEMENT ANALYSIS (FEA); INDUCED STRESSES; NEW MATERIALS; PART DEFLECTION; PLANAR SOLID OXIDE FUEL CELL; PLASTIC STRAINING; PROPER DESIGN; SCALE-UP; SEAL DESIGN; SIZE AND SHAPE; STRESS MITIGATION; TEST SPECIMENS; UNIFORM HEATING;

EID: 48949120024     PISSN: 03603199     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijhydene.2007.11.008     Document Type: Article
Times cited : (99)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.