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Volumn 33, Issue 14, 2008, Pages 3976-3990
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Thermal stress analysis of the planar SOFC bonded compliant seal design
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Author keywords
Bonded compliant seal; Finite element analysis; Planar solid oxide fuel cell; Thermal stress
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Indexed keywords
(ABIOTIC AND BIOTIC) STRESS;
(R ,S)-SYMMETRIC;
COOLING CONDITIONS;
DIFFERENTIAL THERMAL EXPANSION;
FINITE ELEMENT ANALYSIS (FEA);
INDUCED STRESSES;
NEW MATERIALS;
PART DEFLECTION;
PLANAR SOLID OXIDE FUEL CELL;
PLASTIC STRAINING;
PROPER DESIGN;
SCALE-UP;
SEAL DESIGN;
SIZE AND SHAPE;
STRESS MITIGATION;
TEST SPECIMENS;
UNIFORM HEATING;
CELLS;
DIRECT ENERGY CONVERSION;
ELECTRIC BATTERIES;
FINITE ELEMENT METHOD;
FUEL CELLS;
METAL FOIL;
METALS;
PARAMETER ESTIMATION;
SOLID OXIDE FUEL CELLS (SOFC);
STRAIN;
STRENGTH OF MATERIALS;
THERMAL SPRAYING;
THERMAL STRESS;
THERMOELASTICITY;
WINDOWS;
THERMAL EXPANSION;
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EID: 48949120024
PISSN: 03603199
EISSN: None
Source Type: Journal
DOI: 10.1016/j.ijhydene.2007.11.008 Document Type: Article |
Times cited : (99)
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References (24)
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