Modeling the formation of spontaneous wafer direct bonding under low temperature

Microelectronic Engineering

Volumn 85, Issue 8, 2008, Pages 1754-1757

  Tang, Zirong ^a,b   Shi, Tielin ^a,b   Liao, Guanglan ^a,b   Liu, Shiyuan ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Low temperature; Modeling; Nano scale roughness; Spontaneous wafer bonding

Indexed keywords

INTERFACIAL ENERGY; OPTICAL DESIGN; SILICON WAFERS;

(1 1 0) SURFACE; (100) SILICON; BONDING ENERGIES; CRITICAL TECHNOLOGIES; ELSEVIER (CO); EXTERNAL PRESSURES; INTERFACIAL ADHESION ENERGY; JOHNSON-KENDALL-ROBERTS (JKR) THEORY; LOW TEMPERATURE (LTR); NANO SCALE ROUGHNESS; NANO TOPOGRAPHY; WAFER DIRECT BONDING;

WAFER BONDING;

EID: 48949116064     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.04.038     Document Type: Article

References (12)

1. Tong Q., and Gösele U. Semiconductor Wafer Bonding: Science and Technology (1999), John Wiley & Sons, New York
2. Gösele U., Stenzel H., and Martini T. Appl. Phys. Lett 67 (1995) 3614
3. Johnson K.L., Kendall K., and Roberts A.D. Proc. Roy. Soc. Lon. Ser. A 324 (1971) 301
4. S. Farrens, J. Dekker, in: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications, Reno, NV, 1995, p. 184.
5. Bengtsson S., Ljungberg K., and Vedde J. Appl. Phys. Lett. 69 (1996) 3381
6. Yu H., and Suo Z. J. Mech. Phys. Solids 46 (1998) 829
7. Gui C., Elwenspoek M., and Tas N. J. Appl. Phys 85 (1999) 7448
8. T. Martini, E. Schmidt, S. Mack, M. Reiche, H. Stenzel, S. Li, U. Gosele, Q. Tong, in: Proceedings of Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications, Reno, NV, 1995, p. 147.
9. Reiche M., Scheerschmidt K., Conrad D., Scholz R., Plossl A., Gosele U., and Tu K. Proc. Roy. Microsc. Soc. Conf. (1997) 447
10. Maugis D. J. Colloid Interf. Sci. 150 (1992) 243
11. Greenwood J.A., Johnson K.L., and Matsubara E. Wear 100 (1984) 47
12. Hui C.Y., Lin Y.Y., Naney J.M., and Kramer E.J. J. Polym. Sci. Part B: Polym. Phys. 39 (2001) 1195